Advanced Interconnections Releases Interposers for Lead-Free BGA Devices in Tin/Lead Reflow Profiles

July 1, 2007 // Published as a news service by IHS

Advanced Interconnections introduced new ball grid array (BGA) interposers for converting lead-free BGA device packages for use on boards processed with lower temperature, tin/lead solder profiles.

Designed for Restriction of Hazardous Substances Directive (RoHS) exempt applications, the interposers are designed to solve BGA device transition, obsolescence and solderability issues associated with the higher temperature requirements to process lead-free BGA packages, said Advanced Interconnections.

Advanced's turnkey solution consists of a lead-free BGA device attached to an interposer adapter board in a high temperature reflow process, followed by mounting of eutectic (63/37) tin/lead solder balls on the bottom of the interposers , said Advanced Interconnections.

The interposer assembly is shipped ready for use on existing PC boards, eliminating the need to change tin/lead solder profiles or subject other components to higher processing temperatures, said Advanced Interconnections.

Advanced said it offers an interposer solution including high temperature, FR-4 adapter boards that closely match the original package size, eutectic (63/37) tin/lead solder balls and an in-house lead-free BGA device attach.

Device-specific interposers match the device footprint and are available in 0.80, 1.00 and 1.27 millimeter pitch. Tape and reel packaging is also available.

Source: Advanced Interconnections Corp.